Blackberry Z10 pads under PMIC came off

Hello, I have BB Z10 STL100-2 and some pads under PMIC (PM8921) were damaged, probably because chip was glued underside to pcb and when removing it, I used not enough heat or the wick took off some of them 🙁

Althought, when I look the missing ones and compare them with schematic those pads are not used? (marked yellow on schem)

Can I solder a new chip without pads visible on photo? Can you confirm?

-missing pads photo:
https: //s32. postimg. org/x33ss5uhx/bb_pimc_pad_off. png

-schematic photo:
https: //s31. postimg. org/6pl8i2tkb/schem. png